Jupiter Design Technologies specialized in the manufacture of a wide range of board types. The company’s emphasis on R&D has helped Jupiter become a market leader in the development and manufacturing of next-generation PCBs.

Jupiter utilizes a variety of technologies in board manufacturing

  • Blind and Buried via Technology
  • Micro via Technology
  • "Bookbinder” Rigid-Flex Technology
  • SMT and BGA Technology
  • Qualified & certified vendor for Electronic package Test Console Systems
  • RF and Microwave Technology

The company manufactures a wide range of board types

  • Rigid up to 40 layers
  • Flex and rigid-flex up to 28 layers
  • Metal core boards: Copper, Aluminum, Copper Invar Copper
  • Boards with heave sinks: Copper and Aluminum (2D or 3D)


  • MIL-PRF-55110 Type 2- for GY
  • MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
  • Mil-P50884 Type-4 – for rigid-flex (adhesive and adhesiveless)
  • UL approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and Adhesivless based product

Our Products